Mr. Bimal has 25 years of working experience in the Semiconductor Industry and 2 years in Engineering Education from 1994 to 2019 having worked in Semiconductor Industry in names such as Motorola, Freescale, On and Infineon Semiconductor. Well versed in Front End Surface Mount and Flip Chip Technology. Headed and successfully completed several projects involving New Product Introduction, Quality and Productivity Improvement. Developed necessary Quality Systems for the Development Lab to meet IATF16949 standards at Infineon Semiconductor from 2019 to 2021.
Effectively applied Six Sigma Statistical Tools, DMAIC and Kaizen concepts to various projects. Implemented FMEA, Poka Yoke and Statistical Control Charts to improve and sustain high quality standards in line with the Six Sigma concept to new and existing processes.
Qualified and Introduced New processes such as Laser Groove sawing and UV cure in the Flip Chip process flow. Have qualified and upgraded several new equipment at Die Attach, Pick and Place, Reflow and Cleaning processes among others.